Revolutionizing Integrated Photonics

Optical communication networks, AI data-centers and cutting-edge sensors are critically dependent on optical chips, yet the core technologies available to efficiently integrate multiple materials on a single photonic chip are a fundamental barrier. Existing photonic integration technologies can’t deliver the performance, energy efficiency and the small footprint required.

We reinvent the way silicon and different III-V materials such as indium phosphide (essential for lasers and high-performance modulators) are integrated onto a single photonic chip. This breakthrough radically simplifies the manufacturing process and opens a path towards mass deployment for advanced low-power optical engines for a wide range of applications.

PIC devices from Photon IP deliver best in class energy efficiency, with no compromise on optical performance; and our simplified manufacturing processes and single chip solutions make it quicker and easier for our customers to get to market.